ECTC 2026 Roundup, Intel, TSMC, SK Hynix, Samsung, Micron, Marvell, Lightmatter
The article provides a roundup of developments from ECTC 2026, covering advancements from Intel, TSMC, SK Hynix, Samsung, Micron, Marvell, and Lightmatter in semiconductor packaging and interconnect technologies.
Background
This is a roundup from SemiAnalysis, a subscription industry newsletter known for deep technical analysis of the semiconductor supply chain. ECTC (Electronic Components and Technology Conference) is a major annual conference where chipmakers present cutting-edge research on packaging, interconnects, and advanced manufacturing — topics that are now critical because Moore's Law scaling (making transistors smaller) is slowing, so the industry relies on "advanced packaging" and chiplets to keep improving performance.